Pac Tech Integrated Solutions

Pac Tech (Packaging Technologies) is a prominent manufacturer specializing in equipment and services for the semiconductor assembly and packaging industry. The company is best known for its innovative technologies in wafer level packaging, including chemical and electrolytic bumping, as well as solder ball placement and laser reflow systems.

Founded in Nauen, Germany, in 1995, Pac Tech established itself as a leader in high-precision micro-dispensing and laser-assisted solder jetting technology. Over the years, it expanded its global footprint to meet the demands of the global semiconductor supply chain, establishing significant operations in the United States and Southeast Asia.

In the early 2000s, Pac Tech was acquired by the Nagase Group, a major Japanese chemical and electronics distributor. Since then, it has operated as a key subsidiary within Nagase's manufacturing portfolio, leveraging the parent company's extensive distribution network while maintaining its core engineering and manufacturing excellence in Germany.